Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® [electronic resource] /

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Bibliographic Details

Main Authors:	Madenci, Erdogan. author., Guven, Ibrahim. author., Kilic, Bahattin. author., SpringerLink (Online service)
Format:	Texto biblioteca
Language:	eng
Published:	Boston, MA : Springer US : Imprint: Springer, 2003
Subjects:	Engineering., Manufacturing industries., Machines., Tools., Electrical engineering., Optical materials., Electronic materials., Manufacturing, Machines, Tools., Optical and Electronic Materials., Electrical Engineering.,
Online Access:	http://dx.doi.org/10.1007/978-1-4615-0255-5
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